InterplaneRequest Design-Partner Access

AI SYSTEM CO-DESIGN & PERFORMANCE INTELLIGENCE

Model AI and hardware together. Optimize both.

Interplane creates an executable representation of AI workloads, compute architectures, memory systems, interconnects, and runtime behavior so teams can identify bottlenecks and evaluate changes before committing to hardware.

Early access for AI infrastructure and semiconductor design teams

Physics-aware modelingHardware + AI co-designRuntime policy exploration

AN EXECUTABLE MODEL OF YOUR AI SYSTEM

AI Workload / Model

  • Model architecture
  • Precision
  • Batching
  • Partitioning
  • Communication patterns
  • Runtime and scheduling
InterplaneModel · Analyze · Optimize
Map & Execute
Insights & Recommendations

Hardware System

  • Compute
  • Memory and storage
  • Chiplets
  • Topology
  • Interconnect and I/O
  • Power and thermal constraints

Outcomes

Make better decisions across the AI hardware lifecycle.

Explore design spaces

Rapidly evaluate architecture, topology, and partitioning alternatives.

Uncover bottlenecks

Identify where compute, memory, interconnect, and I/O limit performance.

Co-optimize AI and hardware

Tune models and hardware together for greater efficiency.

Reduce risk and cost

Avoid expensive respins and infrastructure mistakes before committing.

Inform runtime policies

Design better scheduling, placement, routing, and load-balancing policies.

Scale with confidence

Analyze systems from chip and package through rack and data center.

How It Works

Start broad, then add detail where it changes a decision.

Interplane supports an executable world model for AI-system performance: a structured representation of workload, hardware, interconnect, and runtime choices that can be explored together.

01

Architecture Insight

Compare architecture choices quickly and identify where performance is likely to be constrained.

02

Performance Insight

Understand how complete workloads interact with compute, memory, and communication resources.

03

Interconnect Insight

Examine communication behavior across complex, connected systems.

Current results are internally modeled and uncalibrated. They support controlled relative comparisons and bottleneck analysis, not yet hardware-calibrated wall-clock prediction.

Use Cases

Built for architecture decisions where models and systems meet.

AI accelerator architecture

Compare accelerator, memory, fabric, and package choices around real workload behavior.

Chiplet and heterogeneous integration

Study how chiplets, interposers, I/O, and packaging constraints shape the full system.

Memory and interconnect planning

Evaluate where data movement, memory pressure, and topology choices create bottlenecks.

Runtime and workload placement

Explore scheduling, placement, routing, and load-balancing policies before deployment.

AI infrastructure co-design

Connect chip, package, board, rack, and data-center questions in one design loop.

Early Access

Design with the workload and hardware in the same loop.

Interplane is working with design partners on architecture studies, performance modeling, and hardware-software co-design.

Request a conversation

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